Digi Times — Taiwan Semiconductor Manufacturing Company (TSMC) expects to boost its R&D spending to a record US$2.2 billion in 2016, increasing about 10% on year, according to company co-CEO Mark Liu. TSMC will be the industry’s first chipmaker to have its 7nm process technology certified, said Liu, adding that TSMC’s 7nm currently has 30-40% yield for 128MB SRAM.
Digi Times — The production value of Taiwan’s IC design industry is expected to increase 6.7% sequentially in the second quarter of 2016, thanks to a pick-up in handset demand, according to Digitimes Research. Demand in China’s smartphone market is picking up, and device vendors have started to replenish inventory since March, Digitimes Research indicated.
Digi Times — The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.101 billion to expand capacity for advanced-node manufacturing, as well as converting certain logic capacity to specialty technologies, and R&D capital investments and sustaining capital expenditure.
Digi Times — Taiwan Semiconductor Manufacturing Company (TSMC) is expected to detail its roadmap for 7nm process, including a revised production schedule for the node technology, at an investors meeting on April 14, according to a Chinese-language Economic Daily News (EDN) report.
Digi Times — Taiwan Semiconductor Manufacturing Company (TSMC) announced on March 28 that the company and the municipal government of Nanjing, China have signed an investment agreement. This agreement affirms that TSMC will make an investment in Nanjing valued at US$3 billion to establish TSMC (Nanjing) Co., a wholly-owned subsidiary managing a 12-inch wafer fab and a design service center.
Digi Times — TSMC and MediaTek have announced their commitment to a long-term partnership to continue developing innovative products for Internet of Things (IoT) and wearable device applications based on TSMC’s ultra-low power (ULP) technology platform. Under the ULP platform, TSMC offers multiple processes to provide significant power reduction benefits for IoT and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers.
Digi Times — ARM and TSMC have announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs. The new agreement expands the companies’ long-standing partnership and advances leading-edge process technologies beyond mobile and into next-generation networks and data centers.
Digi Times — Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) is expected to see 50% of its 2016 revenues generated from orders placed by its fabless customers based in China and Taiwan, according to industry sources. TSMC used to have more than 80% of its total revenues generated from orders placed by its non-Greater China customers, but the proportion has declined in recent years, said the sources.
Digi Times — As of December 2015, Taiwan led all regions/countries in wafer capacity with nearly 22% of worldwide IC capacity installed in the country, according to IC Insights. Taiwan surpassed South Korea in 2015 to become the largest capacity holder after having passed Japan in 2011.
Digi Times — China- and Taiwan-based IC design houses including MediaTek, HiSilicon Technologies and Spreadtrum Communications have placed 16nm chip orders with Taiwan Semiconductor Manufacturing Company (TSMC) and begun to step up their pace of orders, according to industry sources. Apple is another key customer of TSMC’s 16nm technology for 2016, the sources indicated. Orders from Apple, and TSMC’s other main mobile SoC clients based in China and Taiwan, will fill the foundry’s 16nm process capacity in 2016, the sources said.
Digi Times — TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apple will be among the first wave of TSMC customers adopting the technology, the Chinese-language Commercial Times cited a Goldman Sachs analyst as saying in a recent report.
Digi Times — The announcement by Taiwan Semiconductor Manufacturing Company (TSMC) to build a 12-inch wafer manufacturing facility in Nanjing, China heralds the establishment of a cluster of semiconductor industry in China as well as a takeoff of China’s semiconductor industry in coming years.
Digi Times — The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of US$3.96 billion for expanding capacity for advanced-node manufacturing, and packaging and assembly, as well as construction of fab facilities and installation of facility systems, and first-quarter 2016 R&D capital investments and sustaining capital expenditures.
Digi Times — The chairmen of MediaTek and TSMC both agree that Taiwan’s government should be more liberal towards the issue of allowing China-based firms to invest in the local IC industry sectors, and pursue an open policy for the local chipmakers’ cooperation with their China-based counterparts.
China Tech News — TSMC said that due to the declining demands of smartphones in the emerging markets and severe market competition, the company’s net profit was NTD75.33 billion in the third quarter of 2015, a year-on-year drop of 1.3% and a decrease of 5.1% compared with the previous quarter.
Digi Times — Samsung Electronics is offering HiSilicon Technologies lower prices for its 14nm FinFET production in a bid to vie for mobile chip orders from the China-based fabless vendor, according to industry sources. HiSilicon is already among TSMC’s major clients, having placed 16nm chip orders at the Taiwan-based foundry, said the sources.
Digi Times — Cadence Design Systems has announced that its Allegro system-in-package (SiP) and physical verification system (PVS) implementation technologies have been enabled for TSMC’s integrated fan-out (InFO) packaging technology. By providing an integrated solution that automates the design-rule checking (DRC) flow, the Allegro SiP design tools and PVS enable TSMC customers to shorten the InFO design and verification cycle.
Digi Times — Cadence Design Systems has announced an intellectual property (IP) portfolio for TSMC’s 10nm FinFET (N10) process. Cadence has already secured multiple design wins with this portfolio and is actively engaged with customers as adoption of TSMC’s leading-edge process grows. The initial deliveries of Cadence IP for the N10 process demonstrate a 20% power reduction and 50% area reduction compared to TSMC’s 16nm process technology, and are ideal for mobile and network infrastructure applications, Cadence indicated.
Taiwan Semiconductor Manufacturing Company (TSMC) will be the exclusive supplier of Apple’s next-generation A10 processors with volume production to kick off starting March 2016, according to a recent Chinese-language Commercial Times report. TSMC will offer its in-house developed backend integrated fan-out (InFO) wafer-level packaging for the production of the A10 chips, which will be built using the foundry’s 16nm FinFET process technology, said the report, which cited unspecified Apple suppliers as its source.
Digi Times — The recent inventory adjustments in the semiconductor industry have nearly come to an end, and the possibility is high for the industry to swing back to a seasonal growth cycle shortly, according to George Liu, director of sensor and driver business development at TSMC. Companies and market analysts have been revising their outlook for the 2015 semiconductor market growth, due to weak market demand resulting in higher-than-expected inventory levels in the industry.
Digi Times — Taiwan’s top court has ruled in favor of TSMC in a trade secret case against Liang Mong-song, a former senior director of R&D at TSMC. Liang has been accused of revealing TSMC’s trade secrets and patents related to its advanced process technology to Samsung Electronics. The Supreme Court on August 24 maintained the determination made by the second-instance court, prohibiting Liang from working for Samsung in any form until December 31, 2015.
Digi Times — TSMC would not comment on Advanced Semiconductor Engineering’s (ASE) recently-announced bid to take up a major stake in Siliconware Precision (SPIL), according to the contract chipmaker. As high as 90% of the backend production demanded by TSMC’s fabless clients is designated by the customers, the foundry said. TSMC is working with both ASE and SPIL, it added.
Digi Times — Foundry chipmaker TSMC has been actively pursuing 16nm FinFET chip orders in order to gain a majority of market share in the FinFET segment starting 2016, according to market sources. While securing a portion of Apple’s A9 chip orders, TSMC with its 16nm FinFET node has also obtained orders from AMD, Avago, Broadcom, HiSilicon Technologies, LG Electronics, MediaTek, Nvidia and Xilinx. The foundry is looking to aggressively ramp up its market share in the FinFET segment, the sources indicated.
Digi Times — China-based IC foundries including Semiconductor Manufacturing International (SMIC) and Huali Microelectronics (HLMC), and backend firms such as Jiangsu Changjiang Electronics Technology (JCET) and Nantong Fujitsu Microelectronics (NFME) are soliciting orders from Taiwan’s fabless IC firms, according to industry sources.
Digi Times — TSMC has maintained that volume production and ramp of its 16nm process is proceeding smoothly in line with its schedule, amid media speculation indicating the foundry is seeing a cutback of 16nm chip orders from Apple. Apple is requesting price cuts from its A9 chip suppliers Samsung Electronics and TSMC, which already have their 14/16nm FinFET process capacity ready for the chip that will be featured in new iPhone models slated for launch in the second half of 2015, according to industry sources.
Digi Times — Acer has reportedly obtained orders for servers used in data centers from Taiwan Semiconductor Manufacturing Company (TSMC), which could affect TSMC’s orders to its original supplier IBM, according to sources from the upstream supply chain. Although Lenovo’s share in the server market has quickly picked up from 3% to 8% after acquiring IBM’s x86 server business, some of IBM’s original clients have concerns and have started to look eleswhere for supplies, the sources said.
Digi Times — Apple is not expected to launch a successor to the iPhone 5c this year, but will instead introduce its next-generation budget smartphones in second-quarter 2016 with the devices coming with 14/16nm FinFET chips, according to sources from the semiconductor industry. The 14/16nm FinFET chips will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung, the sources said.
Want China Times — Taiwan is expected to grab the title as the largest spender on semiconductor equipment in 2015, according to an estimate released by the trade association Semiconductor Equipment and Materials International (SEMI). SEMI said that Taiwan’s chip equipment spending is expected to total US$10.9 billion in 2015, ahead of South Korea’s estimated US$8.6 billion and North America’s US$6.5 billion.
Digi Times — Taiwan Semiconductor Manufacturing Company (TSMC), at its July 16 investors meeting, gave a less-optimistic outlook for the third quarter of 2015, and has revised downward its forecast for 2015 global semiconductor and foundry growth. TSMC co-CEO Mark Liu indicated the company now forecasts the global semiconductor market will grow 3% in sales in 2015, and the foundry segment will see a 6% increase.
Digi Times — TSMC has reiterated plans to move 10nm FinFET technology to risk production at the end of 2016, followed by mass production in the first quarter of 2017. Commercial production of chips made on the new process will take place in TSMC’s manufacturing site at the Central Taiwan Science Park (CTSP) in Taichung, the foundry disclosed.