TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract chip maker, said Tuesday it has completed a silicon validation of 64-bit chips made on the 16 nanometer process for British chip designer ARM Holdings PLC, representing a breakthrough in cooperation for the industry giants. The silicon results on TSMC’s advanced 16-nm FinFET process technology show that the Cortex-A57 processor can achieve a speed of 2.3 GHz for sustained mobile peak performance, while the lower-end Cortex-A53 processor consumes 75 milliwatts for most common workloads, it said in a statement.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, is expected to take an 84-percent share in the high-end technology market of the global semiconductor wafer foundry business, according to a research report. In the report, market information advisory firm IC Insights said that TSMC is expected to post US$10.3 billion in sales from the 28 nanometer process or more advanced chip making technology in 2014, accounting for about 84 percent of the global total.
Chip suppliers are expected to begin to pull in orders for wafers in order to produce chips for non-Apple device vendors, a move which is likely to start a new round of competition for wafer capacity, according to industry sources. Most wafer foundry houses, particularly Taiwan Semiconductor Manufacturing Company (TSMC), have been running nearly at full capacity since the beginning of 2014 as they have to ramp up output to meet demand from non-Apple device vendors in the first half of the year before related Apple suppliers begin to pull in orders in the second half.
TAIPEI — A product teardown by research firm IHS Inc. has found that South Korea’s Samsung Electronics Co. is still supplying some processor chips for Apple Inc.’s larger-screen iPhones, although more orders are going to Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電). In an analysis report published Tuesday, IHS said the Apple-designed A8 processor used in both the 4.7-inch iPhone 6 and the 5.5-inch iPhone 6 Plus is not supplied entirely by Samsung, signaling a major departure in component supplier selection from previous iPhone models.
TAIPEI–A new cost-competitive 28-nanometer process developed by Taiwan Semiconductor Manufacturing Co. (TSMC, 台灣積體電路) may help the world’s largest contract chip maker gain more market share, according to Germany’s Deutsche Bank AG. TSMC announced Sept. 12 that it has started mass production of the 28-nanometer High Performance Compact (28HPC) process, claiming it to be the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment.
Foreign chipset suppliers have placed follow-up orders for chips to be used in iPhone 6 devices with Taiwan Semiconductor Manufacturing Company (TSMC), extending order visibility of foundry houses to the first quarter of 2015, according to industry sources. Some analog IC suppliers indicated that Apple aims to ship 80-100 million units of the iPhone 6 and iPhone 6 Plus in 2014, and initial response to the new iPhone devices seems to be enthusiastic and could gain momentum.
TAIPEI, Taiwan — According to a recent report by Deutsche Bank AG, TSMC (台積電) is poised to command more than 70 percent of the global market for 28-nanometer and 32-nanometer semiconductor fabrication, as the Taiwan-based sector bellwether commences mass production of its high-performance 28-nanometer variant (HPC) designed to power low- and mid-tier mobile devices.
TAIPEI, Taiwan — As global markets await the unveiling of Apple’s iPhone 6 handset, reports indicate that analysts are expecting TSMC to secure manufacturing orders for the U.S.-based company’s upcoming A9 processor that is slated to power next year’s iPhone handset. Given its status as the bellwether of the smartphone sector, the contest to secure manufacturing orders for the processor powering each year’s iPhone handset has become the most important battle for semiconductor companies worldwide.
TAIPEI, Taiwan — Both Taiwanese and Chinese businesses need to develop their innovation ability, and by doing so, companies across the strait will no longer need to rely on toil and sweat to make a profit, said a senior officer of Semiconductor Manufacturing Co. (TSMC,台積電) yesterday. The comment was made by TSMC’s Chinese business division deputy general manager Luo Zhen-qiu (羅鎮球), who attended a forum that discussed cross-strait semiconductor industry cooperation and development. Luo touched on how businesses across the strait may compliment each other.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), Hon Hai Precision Industry Co., and MediaTek Inc. ranked as the three largest research and development spenders among the manufacturers listed on Taiwan’s main board and the over-the-counter (OTC) market in the second quarter of his year, according to the Ministry of Economic Affairs (MOEA). Citing statistics, the MOEA said that the TSMC, the world’s largest contract chip maker, spent NT$13.6 billion (US$453 million) in R&D expenses during the April-June period, topping R&D spending rankings among Taiwan’s listed manufacturers.
Taiwan Semiconductor Manufacturing Company (TSMC) has informed Taiwan-based IC design houses that its production capacity for the fourth quarter of 2014 is almost fully booked, and urged vendors which are short of production capacity to book wafer orders in advance, according to industry sources. While the supply of wafers at TSMC is tight for the third quarter, the nearly sold-out wafer production for the fourth quarter at TSMC has placed most IC design houses in a dilemma as to whether they should queue up at TSMC for capacity.
A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open bid for taking over an idle 12-inch fab owned by ProMOS Technologies, according to industry sources. The 12-inch fab, located in Taichung Science Park (TSP), has been idle since March 2013 after ProMoS sold the bulk of production equipment of the fab to Globalfoundries. But the fab has completed the construction of its cleanroom and can resume operations if production equipment is reinstalled, said the sources.
More than 10 China-based IC design houses and IC design service companies have placed 28nm chip orders at Taiwan Semiconductor Manufacturing Company (TSMC), indicating the strengthening competitiveness of China-based IC suppliers, according to industry sources. China-based IC design houses that have tapped TSMC for 28nm foundry capacity include HiSilicon Technologies, Spreadtrum Communications, Rockchip Electronics, Allwinner Technology and RDA Microelectronics and Datang
On the request of MediaTek, Taiwan Semiconductor Manufacturing Company (TSMC) will supply MediaTek with wafer starts 10% more than what the chipset maker expected to receive in the third quarter of 2014, according to industry sources. In view of MediaTek’s growing share in the global entry-level to mid-range smartphone solution market, and the need to maintain a high order visibility at TSMC, the offering of more 28nm production capacity to MediaTek is an important strategy for the Taiwan-based foundry house, said the sources.
Apple is expected to become the largest client for Taiwan Semiconductor Manufacturing Company (TSMC) as the Taiwan-based foundry house has begun to ramp up production of A8 processors and is likely to continue to fabricate the vendor’s A9 CPUs in 2015, according to industry sources. Although TSMC appears to have lost Qualcomm’s 14nm chip orders to Samsung Electronics, TSMC will win Apple’s A9 processor orders with its 16nm process, explained the sources.
Taiwan Semiconductor Manufacturing Company (TSMC) should support MediaTek with its technology and production capacity to counter the alliance between Samsung Electronics and Qualcomm in order to prevail in the 14/16nm segment. TSMC chairman Morris Chang admitted recently that TSMC will lose out to competitors in the 14/16nm process segment in terms of market share in 2015 before regaining its leading market position in 2016-2017.
Taiwan Semiconductor Manufacturing Company (TSMC) will lose out to competitors in the 14/16nm process segment in terms of market share in 2015 but will regain its leading market position in 2016-2017, according to TSMC chairman Morris Chang. 16nm products will account for a single-digit ratio to TSMC’s overall revenues in the third quarter of 2015, Chang estimated.
China-based smartphone vendor Huawei is likely to be the first client for Taiwan Semiconductor Manufacturing Company’s 16nm FinFET process node, according to industry sources. The 16nm chip, designed for smartphone application, is developed by Huawei’s subsidiary HiSilicon Technologies and is expected to debut in early 2015, said the sources. In addition to the wafer foundry orders, Huawei has also decided to utilize TSMC’s backend CoWoS (chip on wafer on substrate) packaging process for the 16nm chips, the sources added.
Taiwan Semiconductor Manufacturing Company (TSMC) plans to speed up the development of its 10nm process to fend off competition from Samsung Electronics, which reportedly has landed 14nm FinFET chip orders from Qualcomm, according to industry sources. TSMC and Samsung are currently competing fiercely in the development of FinFET process, with the Korea-based foundry house utilizing a 14nm process and TSMC a 16nm node. Both the 14nm and 16nm processes are scheduled to enter volume production in early 2015.
TAIPEI, Taiwan — Market capitalization of Taiwan Semiconductor Manufacturing Co. (TSMC,台積電), the most heavily weighted stock in the local market, hit a record high Wednesday after the stock steamed ahead amid optimism over its earnings outlook. TSMC rose 3.52 percent to close at the day’s high of NT$132.50 with 51.46 million shares changing hands on the Taiwan Stock Exchange. The buying spree took place on optimism over the chip-maker’s earnings prospects.