TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC) Chairman Morris Chang said Saturday that he will continue to raise his stake in the world’s largest contract chip maker due to strong confidence in the company’s competitive edge over its peers. On the sidelines of TSMC’s annual sports day event, Chang said that his company is gearing up to develop the advanced 16 nanometer process and he has faith that the company will take the lead in 16nm technology development in 2016.
Taiwan Semiconductor Manufacturing Co. is putting a positive spin on China’s investments aimed at making its chip industry a competitive, global powerhouse. “We think our business opportunity in China will grow, will be bigger, with this development,” said Mark Liu, co-CEO of TSMC during a conference call to discuss earnings. This week, China announced it had set up a fund to develop the country’s semiconductor industry, with local media reporting that the initial investments could amount to 120 billion yuan (US$19.5 billion).
Taiwan Semiconductor Manufacturing Co. is putting a positive spin on China’s investments aimed at making its chip industry a competitive, global powerhouse. “We think our business opportunity in China will grow, will be bigger, with this development,” said Mark Liu, co-CEO of TSMC during a conference call to discuss earnings.
Taiwan Semiconductor Manufacturing Company (TSMC) will begin volume production of 16nm FinFET process products in the second quarter or early third quarter of 2015, according to company co-CEO CC Wei. Despite rising competition, TSMC will continue to lead its peers in the combined segment of 20nm and 16nm processes, Wei said at the company’s latest investors conference.
Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly landed CPU orders for Apple’s upcoming next-generation iPad expected to be released in early 2015, according to sources familiar with the matter. TSMC is currently fabricating Apple’s A8 processors for the iPhone 6 devices, which hit the market recently and total shipments are expected to reach 70-80 million by the end of 2014.
ARM and Taiwan Semiconductor Manufacturing Company (TSMC) have announced a new multi-year agreement that will deliver ARMv8-A processor IP optimized for TSMC 10nm FinFET process technology. Because of the success in scaling from 20nm SoC to 16nm FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early pathfinding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10nm FinFET designs as early as the fourth quarter of 2015.
TSMC (台積電) and ARM Holding Co. on Thursday announced a collaborative development initiative on the 10-nanometer (nm) Fin Field-Effect transistor (FinFET) fabrication technology designed for the ARMv8-A architecture capable of 64-bit support. Reports indicate that with aid from ARM and TSMC, clients will be able to assess and implement the 10nm FinFET fabrication intellectual property for 64-bit applications in the fourth quarter of next year at the earliest.
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract chip maker, said Tuesday it has completed a silicon validation of 64-bit chips made on the 16 nanometer process for British chip designer ARM Holdings PLC, representing a breakthrough in cooperation for the industry giants. The silicon results on TSMC’s advanced 16-nm FinFET process technology show that the Cortex-A57 processor can achieve a speed of 2.3 GHz for sustained mobile peak performance, while the lower-end Cortex-A53 processor consumes 75 milliwatts for most common workloads, it said in a statement.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, is expected to take an 84-percent share in the high-end technology market of the global semiconductor wafer foundry business, according to a research report. In the report, market information advisory firm IC Insights said that TSMC is expected to post US$10.3 billion in sales from the 28 nanometer process or more advanced chip making technology in 2014, accounting for about 84 percent of the global total.
Chip suppliers are expected to begin to pull in orders for wafers in order to produce chips for non-Apple device vendors, a move which is likely to start a new round of competition for wafer capacity, according to industry sources. Most wafer foundry houses, particularly Taiwan Semiconductor Manufacturing Company (TSMC), have been running nearly at full capacity since the beginning of 2014 as they have to ramp up output to meet demand from non-Apple device vendors in the first half of the year before related Apple suppliers begin to pull in orders in the second half.
TAIPEI — A product teardown by research firm IHS Inc. has found that South Korea’s Samsung Electronics Co. is still supplying some processor chips for Apple Inc.’s larger-screen iPhones, although more orders are going to Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電). In an analysis report published Tuesday, IHS said the Apple-designed A8 processor used in both the 4.7-inch iPhone 6 and the 5.5-inch iPhone 6 Plus is not supplied entirely by Samsung, signaling a major departure in component supplier selection from previous iPhone models.
TAIPEI–A new cost-competitive 28-nanometer process developed by Taiwan Semiconductor Manufacturing Co. (TSMC, 台灣積體電路) may help the world’s largest contract chip maker gain more market share, according to Germany’s Deutsche Bank AG. TSMC announced Sept. 12 that it has started mass production of the 28-nanometer High Performance Compact (28HPC) process, claiming it to be the most power- and cost-efficient solution among all 28-nanometer technologies in the foundry segment.
Foreign chipset suppliers have placed follow-up orders for chips to be used in iPhone 6 devices with Taiwan Semiconductor Manufacturing Company (TSMC), extending order visibility of foundry houses to the first quarter of 2015, according to industry sources. Some analog IC suppliers indicated that Apple aims to ship 80-100 million units of the iPhone 6 and iPhone 6 Plus in 2014, and initial response to the new iPhone devices seems to be enthusiastic and could gain momentum.
TAIPEI, Taiwan — According to a recent report by Deutsche Bank AG, TSMC (台積電) is poised to command more than 70 percent of the global market for 28-nanometer and 32-nanometer semiconductor fabrication, as the Taiwan-based sector bellwether commences mass production of its high-performance 28-nanometer variant (HPC) designed to power low- and mid-tier mobile devices.
TAIPEI, Taiwan — As global markets await the unveiling of Apple’s iPhone 6 handset, reports indicate that analysts are expecting TSMC to secure manufacturing orders for the U.S.-based company’s upcoming A9 processor that is slated to power next year’s iPhone handset. Given its status as the bellwether of the smartphone sector, the contest to secure manufacturing orders for the processor powering each year’s iPhone handset has become the most important battle for semiconductor companies worldwide.
TAIPEI, Taiwan — Both Taiwanese and Chinese businesses need to develop their innovation ability, and by doing so, companies across the strait will no longer need to rely on toil and sweat to make a profit, said a senior officer of Semiconductor Manufacturing Co. (TSMC,台積電) yesterday. The comment was made by TSMC’s Chinese business division deputy general manager Luo Zhen-qiu (羅鎮球), who attended a forum that discussed cross-strait semiconductor industry cooperation and development. Luo touched on how businesses across the strait may compliment each other.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), Hon Hai Precision Industry Co., and MediaTek Inc. ranked as the three largest research and development spenders among the manufacturers listed on Taiwan’s main board and the over-the-counter (OTC) market in the second quarter of his year, according to the Ministry of Economic Affairs (MOEA). Citing statistics, the MOEA said that the TSMC, the world’s largest contract chip maker, spent NT$13.6 billion (US$453 million) in R&D expenses during the April-June period, topping R&D spending rankings among Taiwan’s listed manufacturers.
Taiwan Semiconductor Manufacturing Company (TSMC) has informed Taiwan-based IC design houses that its production capacity for the fourth quarter of 2014 is almost fully booked, and urged vendors which are short of production capacity to book wafer orders in advance, according to industry sources. While the supply of wafers at TSMC is tight for the third quarter, the nearly sold-out wafer production for the fourth quarter at TSMC has placed most IC design houses in a dilemma as to whether they should queue up at TSMC for capacity.
A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open bid for taking over an idle 12-inch fab owned by ProMOS Technologies, according to industry sources. The 12-inch fab, located in Taichung Science Park (TSP), has been idle since March 2013 after ProMoS sold the bulk of production equipment of the fab to Globalfoundries. But the fab has completed the construction of its cleanroom and can resume operations if production equipment is reinstalled, said the sources.
More than 10 China-based IC design houses and IC design service companies have placed 28nm chip orders at Taiwan Semiconductor Manufacturing Company (TSMC), indicating the strengthening competitiveness of China-based IC suppliers, according to industry sources. China-based IC design houses that have tapped TSMC for 28nm foundry capacity include HiSilicon Technologies, Spreadtrum Communications, Rockchip Electronics, Allwinner Technology and RDA Microelectronics and Datang