Digi Times — The new Xilinx MPSoC series – dubbed Zynq UltraScale Plus – combines seven user programmable processors including a quad-core 64-bit ARM Cortex-A53 application processing unit, a dual-core 32-bit ARM Cortex-R5 real-time processing unit, and an ARM Mali-400 graphics processing unit. The Zynq UltraScale+ MPSoC family also includes a host of integrated peripherals, safety and security features, and advanced power management.
Want China Times — Taiwan Semiconductor Manufacturing Co, the world’s largest contract chip maker, is expected to secure more than half the orders for Apple’s new mobile chip in 2016 thanks to better production capacity planning. “The Taiwanese manufacturer has a clearer roadmap for capacity planning next year, so we expect it to gain a higher market share next year,” an analysts at a European brokerage told CNA in a recent interview, referring to more than 50% of the orders for Apple’s A10 chips in 2016.
Want China Times — Taiwan Semiconductor Manufacturing Co (TSMC) has retained the title as the largest corporate taxpayer in northern Taiwan, the National Taxation Bureau under the country’s Ministry of Finance said Wednesday. According to statistics compiled by the bureau’s northern area division, TSMC, the world’s largest contract chip maker, paid more than NT$20 billion (US$645 million) in corporate income tax in 2014, the most of any enterprise operating in northern Taiwan.
Taiwan Semiconductor Manufacturing (TSMC) and Hon Hai Precision Industry are among the top firms globally in terms of the number of patents obtained in the United States this year, the only two Taiwanese companies to gain that distinction, according to a recently released list. TSMC, the world’s largest contract chip maker, was granted 620 patents in the US between January and May this year, ranking 16th on the list of the “most innovative” companies worldwide.
TSMC is dedicated to providing foundry services for logic IC providers worldwide, and mergers in the industry will have little impact on the foundry’s operations, said company chairman Morris Chang in response to media queries on Altera’s recent announcement of being acquired by Intel. Many market observers consider that Intel’s acquisition of Altera, which makes use of TSMC’s foundry services, may have an adverse impact on TSMC.
Imagination Technologies has announced the company will work with TSMC to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process for customers. These IP platforms bring together the breadth of Imagination’s IP with TSMC’s advanced process technologies from 55nm down to 10nm.
Cadence Design Systems has announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) IP subsystem demonstration platform for TSMC’s ultra-low power (ULP) process. Targeting wearable, home automation, always-on and industrial control applications, the IP subsystem provides the opportunity to simplify IoT designs and accelerate the time to market for customers, Cadence said.
TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor. Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016, about the same time as TSMC.
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to a recent Economic Daily News (EDN) report. TSMC with its 10nm FinFET node is eyeing orders for Apple’s A10 SoC chips, but Samsung Electronics will also be involved in the race for orders, the report said.
Qualcomm may not serve as one of the top-five clients for Taiwan Semiconductor Manufacturing Company (TSMC) in the second half of 2015 as the US-based chipmaker has placed more 14nm orders with Samsung Electronics, while giving more 28nm orders to United Microelectronics Corporation (UMC) and Semiconductor Manufacturing International Corporation (SMIC), according to industry sources. Qualcomm’s decision may aim to reduce its reliance on TSMC and to avoid its previous experience of not being able to gain enough 28nm foundry capacity from TSMC, the sources noted.
TSMC will reportedly manufacture fingerprint sensors for use in the next-generation iPhone series at its 12-inch wafer fabs using 65nm process technology, according to industry sources. In response, TSMC said the company does not talk about any customer engagements. For existing iPhone models, fingerprint sensors are being built using TSMC’s 0.18-micron process at the foundry’s 8-inch facilities, the sources noted.
Taiwan’s major IC foundries will see their combined revenues decrease 4.5% sequentially in the second quarter of 2015, according to Digitimes Research. Weaker-than-expected smartphone shipments as well as downward pressure on the world economy have prompted many of IC suppliers to continue adjusting their inventory levels.
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has landed SSD controller chip orders from Apple, in addition to recent orders from Marvell Technology and Phison Electronics, according to industry sources. TSMC will utilize a 28nm process to fabricate the controller chips for Apple, widening TSMC’s market share against rival foundry houses including United Microelectronics Corporation (UMC) and Globalfoundries in the segment, said the sources.
Through intensified cooperation with Taiwan Semiconductor Manufacturing Company (TSMC) and MediaTek, semiconductor IP provider ARM performed well in 2014, seeing its clients ship over 12 billion units of ARM-based SoCs and over 550 million units of Mali-based GPUs, mostly to mobile devices such as smartphones and tablets. Simon Segars, CEO of ARM, made a visit to Taiwan recently where he held talks with TSMC chairman Morris Chang about future cooperation on the next-generation 16nm and 10nm processes.
Taiwan Semiconductor Manufacturing Company’s (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry’s revenues in 2016, according to industry sources. TSMC’s in-house developed InFO-WLP technology is expected to attract many orders including orders from Apple in 2016, said the sources. Qualcomm, MediaTek and Huawei are all pinpointed as potential customers of TSMC’s IC backend business.
Foundry chipmaker United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2015, while sales generated from 28nm process technology will continue to grow. UMC reported consolidated revenues of NT$37.65 billion (US$1.20 billion) for the first quarter of 2015, up 1.1% sequentially, when wafer shipments increased 3.5% on quarter. Gross margin and operating margin came to 24.3% and 10.9%, respectively.
Fabless chipmaker MediaTek is expected to enter volume production of its 10-core SoC series for smartphones in the third quarter of 2015, according to industry sources. The chip solutions would be built using TSMC’s 20nm process technology. Codenamed Helios X20, the solution will be aimed at brand smartphone vendors particularly China-based ones, which are looking to upgrade their flagship device processor features to 10 cores, the sources said.
Taiwan Semiconductor Manufacturing Company Ltd. published its performance statistics for March and the first quarter of 2015. According to TSMC, the company achieved operating revenue of NTD222.03 billion, which was about CNY42.25 billion, during the first quarter of 2015, representing a year-on-year increase of 49.8% and a slight decrease of 0.2% compared with the previous quarter.
Internet of Things (IoT) will be the semiconductor industry’s next growth driver, spurring demand for chip components for use in applications particularly automotive, medical/healthcare and smart family, according to TSMC president and co-CEO CC Wei. The healthcare sector, for example, is forecast to reach US$6.8 billion in production value in 2017, said Wei. As for smart family, a family home could feature more than 500 smart devices by 2020, Wei indicated.
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips using 10nm process technology, according to TSMC chairman Morris Chang. Volume production at the new facility of Fab 15 will kick off in mid-2016, said Chang.