TSMC would prefer to set up its own 12-inch wafer fab in China, and management is evaluating the feasibility “aggressively,” according to the Taiwan-based contract chipmaker. There is no time-frame for when TSMC would build a 12-inch fab in China, said the company during an April 16 investors conference. TSMC has been advised by some of its major clients to set up 12-inch wafer facilities in China, and believes that having a local fab for advance-node manufacturing in the region could help it accurately grasp customers needs, the chipmaker indicated.
Taiwan Semiconductor Manufacturing Corp (TSMC) remained the world’s largest semiconductor foundry by taking more than half of the global market in 2014, according to tech research firm Gartner. The revenues of the worldwide semiconductor foundry market grew 16.1% in 2014 to US$46.9 billion, Gartner said in a report published on Monday. Among the top players, TSMC’s market share improved to 53.7% last year from 49.8% in 2013, and its sales increased by US$5 billion to US$25.18 billion due to the success of its advanced process 28 nanometer (nm) and 20nm technologies, Gartner said.
Taiwan Semiconductor Manufacturing (TSMC), the world’s largest semiconductor contract manufacturer, has set a goal of beginning mass production of chips on the 10-nanometer technology by the end of 2016, Mark Liu, its president and chief executive officer, said Wednesday in California. TSMC last year won huge orders for Apple’s next-generation mobile device processors, which had previously been awarded to Samsung of South Korea.
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sources. TSMC will complete the installation of cleanroom facilities at the new facility in May 2016, followed by volume production at the end of the year, said the sources. The Fab 15 Phase 5 facility will be mainly for the manufacture of chips using TSMC’s 10nm process technology, the sources noted.
TAIPEI–Xintec Inc. (精材), an integrated circuit packaging services subsidiary of Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), will list on Taiwan’s over-the-counter (OTC) market on March 30. It has set an issue price of NT$42 (US$1.34) per share for the 30 million new shares to be put on the market and hopes to raise NT$1.26 billion. After the new share issuance, Xintec’s paid-in capital will increase by NT$300 million, based on each share’s par value of NT$10, to NT$2.68 billion.
M31 Technology has announced the availability of its low-voltage and low-power physical IP solutions on TSMC 55nm ultra-low power process technology. The platform provides system-on-a-chip (SoC) designers with significantly competitive low-power advantages for Internet of Things (IoT) applications, said the silicon IP provider. M31’s IP products on TSMC 55nm ultra-low power process technology include “High Density Standard Cell Library,” “General Purpose Standard Cell Library,” “One Port Register File SRAM Compiler,” “Single Port SRAM Compiler,” “Dual Port SRAM Compiler,” “Two Port SRAM Compiler,” and “Via ROM Compiler.”
Taiwan Semiconductor Manufacturing Co, the world’s largest contract chip maker, will likely not be affected by Intel’s rumored acquisition of chipmaking partner Altera, industry analysts said Sunday. Analysts familiar with Taiwan’s semiconductor sector said that because Altera has already shifted most of its orders to Intel from TSMC, the deal would not affect the bellwether Taiwanese company significantly.
Taiwan Semiconductor Manufacturing Company (TSMC) will remain the major processor supplier for Apple in the second half of 2015 as the foundry will supply 20nm chips for an upcoming 6C model and 16nm FinFET chips for 6S models, according to industry sources. TSMC is reportedly the sole supplier of processors for Apple’s iPhone 6 and 6 Plus, which industry observers believe are the best selling iPhone models of all time. Strong demand for the 6 and 6 Plus has boosted TSMC’s sales generated from 20nm process technology.
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to post revenue growth of 0-5% sequentially in the second quarter of 2015, buoyed mainly by rising output for 20nm chips, according to industry sources. Strong sales of Apple’s iPhone 6 and 6 Plus will allow TSMC to enjoy a particularly strong first quarter, said the sources. As a result of the high base recorded for the first quarter, TSMC’s sales for the second quarter will register a modest sequential gain unlike the double-digit increases usually seen in the same quarter in previous years, the sources noted.
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) is expected to win the majority of orders from Apple Inc. for next-generation A9 chips that will be used in new iPhones, as its production processes are faster than rival Samsung Electronics Co., according to an Asia-based brokerage firm. “Market disputes over how many A9 (chip) orders TSMC would gain from Apple against Samsung are coming to an end, in our opinion,” the brokerage firm said, adding that TSMC’s manufacturing processes were superior.
Competition by foundry houses in China and Taiwan on specialty BSI (backside illuminated) technology is heating up after China-based SMIC (Semiconductor Manufacturing International) announced recently that it is ready to fabricate CMOS image sensors using a 0.13-micron BSI process, according to industry sources. Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) both have been using a BSI process to produce chips used in an array of consumer electronics products including smartphones and tablets, said the sources, adding that the process can also produce chips for telematics devices, industrial equipment and high-end monitors.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC台積電) and MediaTek Inc.(聯發科) moved up in a ranking of top research and development spenders in the semiconductor industry, according to a report released Tuesday by market research firm IC Insights. TSMC’s 15 percent R&D spending increase in 2014, along with a decline in spending at Toshiba Corp. and STMicroelectronics NV, helped the Taiwanese company climb two slots to fifth place in the annual ranking.
Output value for the global IC foundry industry is forecast to reach US$54.8 billion in 2015, up 12% from US$49 billion in 2014, according to Digitimes Research. IC demand for 4G smartphones will fuel the foundry sector’s 12% output value growth in 2015, despite several unfavorable factors such as decelerating tablet sales, the continued-slow growth in PC shipments, and an overall slowdown in the growth of smartphone shipments, said Digitimes Research.
Taiwan Semiconductor Manufacturing Company Limited announced on its website that the company will invest over NTD500 billion, which is about USD15.9 billion, to build a new plant to meet the ever-growing demands for chips. The new plant will be located in Central Taiwan Science Park and it is currently undergoing an environmental impact assessment.
TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) announced that it will invest NT$500 billion in the Central Taiwan Science Park (CTSP) to expand manufacturing, creating 5,000 job opportunities in the process. TSMC is expected to introduce today’s most advanced 10-nanometer manufacturing process in the planned expansion.
Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple’s A10 processors, according to industry sources. TSMC with its 20nm process successfully grabbed orders for Apple’s A8 processors. Samsung Electronics had been the exclusive supplier of processors to Apple before TSMC joined the supply chain.
Taiwan Semiconductor Manufacturing Company (TSMC) will gain a majority of market share in the FinFET segment in 2016 although it will lose out to rival Samsung Electronics in 2015, according to TSMC chairman Morris Chang. TSMC will continue to lead in the FinFET segment in 2017, 2018 and beyond, Chang contended at the company’s latest investors conference.
Taiwan Semiconductor Manufacturing Company (TSMC) is to face a slew of tough questions to be asked by institutional investors at its upcoming investors conference to be held on January 15. TSMC is expected to clarify the latest market speculations indicating that Qualcomm reportedly has put a halt on trial production of its next generation chips built using a 16nm FinFET process at TSMC as reported by the Chinese-language Liberty Times on January 14.
TAIPEI, Taiwan — Thanks to sales in mobile devices and orders placed by Apple, Taiwan Semiconductor Manufacturing Co.’s (TSMC, 台積電) sales jumped 27.8 percent to reach an all-time high of NT$762.8 billion last year. Sales of mobile devices in 2014 gave rise to TSMC’s increased 28-nanometer production levels, while Apple’s A8 processors were churned out exclusively through TSMC’s 20-nanometer production.
TSMC has advised its IC design clients to place wafer orders in advance so that they can secure a steady supply during the peak season and meet demand in time, according to industry sources. Many of TSMC’s IC design clients, particularly second-tier and smaller firms, have taken the advice, mainly because they want to avoid competition for wafer production capacity with the foundry’s major clients, the sources said.