Taiwan Semiconductor Manufacturing Company (TSMC) has informed Taiwan-based IC design houses that its production capacity for the fourth quarter of 2014 is almost fully booked, and urged vendors which are short of production capacity to book wafer orders in advance, according to industry sources. While the supply of wafers at TSMC is tight for the third quarter, the nearly sold-out wafer production for the fourth quarter at TSMC has placed most IC design houses in a dilemma as to whether they should queue up at TSMC for capacity.
A number of semiconductor firms, including Taiwan Semiconductor Manufacturing Company (TSMC), Micron Technology, Globalfoundries and Toshiba, are likely to participate in an open bid for taking over an idle 12-inch fab owned by ProMOS Technologies, according to industry sources. The 12-inch fab, located in Taichung Science Park (TSP), has been idle since March 2013 after ProMoS sold the bulk of production equipment of the fab to Globalfoundries. But the fab has completed the construction of its cleanroom and can resume operations if production equipment is reinstalled, said the sources.
More than 10 China-based IC design houses and IC design service companies have placed 28nm chip orders at Taiwan Semiconductor Manufacturing Company (TSMC), indicating the strengthening competitiveness of China-based IC suppliers, according to industry sources. China-based IC design houses that have tapped TSMC for 28nm foundry capacity include HiSilicon Technologies, Spreadtrum Communications, Rockchip Electronics, Allwinner Technology and RDA Microelectronics and Datang
On the request of MediaTek, Taiwan Semiconductor Manufacturing Company (TSMC) will supply MediaTek with wafer starts 10% more than what the chipset maker expected to receive in the third quarter of 2014, according to industry sources. In view of MediaTek’s growing share in the global entry-level to mid-range smartphone solution market, and the need to maintain a high order visibility at TSMC, the offering of more 28nm production capacity to MediaTek is an important strategy for the Taiwan-based foundry house, said the sources.
Apple is expected to become the largest client for Taiwan Semiconductor Manufacturing Company (TSMC) as the Taiwan-based foundry house has begun to ramp up production of A8 processors and is likely to continue to fabricate the vendor’s A9 CPUs in 2015, according to industry sources. Although TSMC appears to have lost Qualcomm’s 14nm chip orders to Samsung Electronics, TSMC will win Apple’s A9 processor orders with its 16nm process, explained the sources.
Taiwan Semiconductor Manufacturing Company (TSMC) should support MediaTek with its technology and production capacity to counter the alliance between Samsung Electronics and Qualcomm in order to prevail in the 14/16nm segment. TSMC chairman Morris Chang admitted recently that TSMC will lose out to competitors in the 14/16nm process segment in terms of market share in 2015 before regaining its leading market position in 2016-2017.
Taiwan Semiconductor Manufacturing Company (TSMC) will lose out to competitors in the 14/16nm process segment in terms of market share in 2015 but will regain its leading market position in 2016-2017, according to TSMC chairman Morris Chang. 16nm products will account for a single-digit ratio to TSMC’s overall revenues in the third quarter of 2015, Chang estimated.
China-based smartphone vendor Huawei is likely to be the first client for Taiwan Semiconductor Manufacturing Company’s 16nm FinFET process node, according to industry sources. The 16nm chip, designed for smartphone application, is developed by Huawei’s subsidiary HiSilicon Technologies and is expected to debut in early 2015, said the sources. In addition to the wafer foundry orders, Huawei has also decided to utilize TSMC’s backend CoWoS (chip on wafer on substrate) packaging process for the 16nm chips, the sources added.
Taiwan Semiconductor Manufacturing Company (TSMC) plans to speed up the development of its 10nm process to fend off competition from Samsung Electronics, which reportedly has landed 14nm FinFET chip orders from Qualcomm, according to industry sources. TSMC and Samsung are currently competing fiercely in the development of FinFET process, with the Korea-based foundry house utilizing a 14nm process and TSMC a 16nm node. Both the 14nm and 16nm processes are scheduled to enter volume production in early 2015.
TAIPEI, Taiwan — Market capitalization of Taiwan Semiconductor Manufacturing Co. (TSMC,台積電), the most heavily weighted stock in the local market, hit a record high Wednesday after the stock steamed ahead amid optimism over its earnings outlook. TSMC rose 3.52 percent to close at the day’s high of NT$132.50 with 51.46 million shares changing hands on the Taiwan Stock Exchange. The buying spree took place on optimism over the chip-maker’s earnings prospects.
Taiwan Semiconductor Manufacturing Company (TSMC) will operate at full capacity in the third and fourth quarters, with revenues generated from 20nm processes to account for 10% of total revenues in the third quarter and rise to 20% in the fourth, according company chairman Morris Chang. The global semiconductor industry is expected to grow 3-5% annually in the next five years, but TSMC’s growth rates will be higher than the industry average, Chang said at the company’s latest shareholders meeting.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC,台積電), the world’s largest contract chip maker, was honored Friday for excellence in promoting a balance between work and life, enabling employees to be as good at “producing” babies as making chips in 2013. TSMC said in a statement that it has won the first “Work Life Balance Award” presented by the Ministry of Labor in recognition of the company’s performance in three areas: employee initiative and achievements, care and support for employee families, and employee health and safety.
Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics are competing to bring more advanced processes to the market, with TSMC eager to promote its 16nm FinFET Plus process, and Samsung planning to push ahead its advanced 14nm LPP (low power plus) process, according to industry sources. TSMC is ready to begin volume production for 16nm FinFET process by the end of 2014, but it has already rolled out an upgraded version, the 16nm FinFET Plus, the sources said.
The lead time for production of 28nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended from 10 to 16 weeks, pushing clients to look for alternative suppliers, according to industry sources. TSMC has informed its clients that it may not be able to fulfill 28nm orders placed in May until September or October due to tight production schedules at its 28nm lines, the sources noted.
Taiwan Semiconductor Manufacturing Company (TSMC) expects its revenues to grow 21-23% sequentially to NT$180-183 billion (US$5.97-6.07 billion) in the second quarter of 2014. Second-quarter gross margin is expected to range from 47.5-49.5% compared to 47.5% a quarter earlier, while operating margin will reach 36.5-38.5%, up from 35.4% in the previous quarter, TSMC said.
TAIPEI: Taiwan Semiconductor Manufacturing Co said Thursday its first-quarter net profit rose 21 per cent year-on-year, boosted by stronger than expected demand for chips used in smartphones and tablets. The world’s biggest contract chip maker said net profit rose to Tw$47.87 billion (US$1.6 billion) in the January-March period, while revenue grew 11.6 per cent to Tw$148.22 billion from a year earlier.
The production capacity of Taiwan Semiconductor Manufacturing Company (TSMC) has been booked through the end of the third quarter of 2014 thanks to orders from handset solution and PC chip vendors, according to industry sources. The planned roll-outs of new smartphones by brand handset vendors and the upcoming 4G services in China have pushed chipset solution vendors to place wafer start orders at TSMC, the sources noted.
Taiwan Semiconductor Manufacturing Company (TSMC) is likely to add two more advanced processes to its 16nm process portfolio in order to compete with the 14nm nodes to be released by Intel and Samsung Electronics, according to industry sources. According to TSMC’s original roadmap, the 16nm FinFET process is expected to enter trial production at the end of 2014.