Competition by foundry houses in China and Taiwan on specialty BSI (backside illuminated) technology is heating up after China-based SMIC (Semiconductor Manufacturing International) announced recently that it is ready to fabricate CMOS image sensors using a 0.13-micron BSI process, according to industry sources. Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) both have been using a BSI process to produce chips used in an array of consumer electronics products including smartphones and tablets, said the sources, adding that the process can also produce chips for telematics devices, industrial equipment and high-end monitors.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC台積電) and MediaTek Inc.(聯發科) moved up in a ranking of top research and development spenders in the semiconductor industry, according to a report released Tuesday by market research firm IC Insights. TSMC’s 15 percent R&D spending increase in 2014, along with a decline in spending at Toshiba Corp. and STMicroelectronics NV, helped the Taiwanese company climb two slots to fifth place in the annual ranking.
Output value for the global IC foundry industry is forecast to reach US$54.8 billion in 2015, up 12% from US$49 billion in 2014, according to Digitimes Research. IC demand for 4G smartphones will fuel the foundry sector’s 12% output value growth in 2015, despite several unfavorable factors such as decelerating tablet sales, the continued-slow growth in PC shipments, and an overall slowdown in the growth of smartphone shipments, said Digitimes Research.
Taiwan Semiconductor Manufacturing Company Limited announced on its website that the company will invest over NTD500 billion, which is about USD15.9 billion, to build a new plant to meet the ever-growing demands for chips. The new plant will be located in Central Taiwan Science Park and it is currently undergoing an environmental impact assessment.
TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Company (TSMC, 台積電) announced that it will invest NT$500 billion in the Central Taiwan Science Park (CTSP) to expand manufacturing, creating 5,000 job opportunities in the process. TSMC is expected to introduce today’s most advanced 10-nanometer manufacturing process in the planned expansion.
Taiwan Semiconductor Manufacturing Company (TSMC) will have its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology ready for 16nm chips, eyeing orders for Apple’s A10 processors, according to industry sources. TSMC with its 20nm process successfully grabbed orders for Apple’s A8 processors. Samsung Electronics had been the exclusive supplier of processors to Apple before TSMC joined the supply chain.
Taiwan Semiconductor Manufacturing Company (TSMC) will gain a majority of market share in the FinFET segment in 2016 although it will lose out to rival Samsung Electronics in 2015, according to TSMC chairman Morris Chang. TSMC will continue to lead in the FinFET segment in 2017, 2018 and beyond, Chang contended at the company’s latest investors conference.
Taiwan Semiconductor Manufacturing Company (TSMC) is to face a slew of tough questions to be asked by institutional investors at its upcoming investors conference to be held on January 15. TSMC is expected to clarify the latest market speculations indicating that Qualcomm reportedly has put a halt on trial production of its next generation chips built using a 16nm FinFET process at TSMC as reported by the Chinese-language Liberty Times on January 14.
TAIPEI, Taiwan — Thanks to sales in mobile devices and orders placed by Apple, Taiwan Semiconductor Manufacturing Co.’s (TSMC, 台積電) sales jumped 27.8 percent to reach an all-time high of NT$762.8 billion last year. Sales of mobile devices in 2014 gave rise to TSMC’s increased 28-nanometer production levels, while Apple’s A8 processors were churned out exclusively through TSMC’s 20-nanometer production.
TSMC has advised its IC design clients to place wafer orders in advance so that they can secure a steady supply during the peak season and meet demand in time, according to industry sources. Many of TSMC’s IC design clients, particularly second-tier and smaller firms, have taken the advice, mainly because they want to avoid competition for wafer production capacity with the foundry’s major clients, the sources said.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, is expected to unveil three dimensional integrated circuit packaging and testing technology in 2015, a research group said Wednesday. Citing a research report, the Market Intelligence & Consulting Institute (MIC), a division of the government-sponsored Institute for Information Industry, said that after years of development, TSMC is expected to launch the advanced 3D integrated fan out (InFO) technology next year.
Taiwan Semiconductor Manufacturing Company (TSMC) has to develop a long-term perspective about investing in China, said company chairman Morris Chang, in response to the China government-led industry investment fund announced recently. TSMC has developed some thoughts about making further investments in China, but they are still immature at this stage, said Chang.
Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity, according to industry sources. Demand for 8-inch wafer capacity has been strong in 2014, buoyed by demand for LCD driver ICs, fingerprint identification sensors, power management (PWM) IC, MEMS devices and MCUs for IoT applications, said the sources.
Qualcomm will contract both Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its 1Xnm chips, whereas MediaTek is also likely to have more than one foundry build its high-end solutions in 2015, according to industry watchers. Judging from tight wafer production capacity and persistent high foundry costs in 2014, Qualcomm, MediaTek and other IC vendors will be eager to look for multiple foundry partners in 2015 as their shipments and performance are likely to be affected by TSMC’s supply capacity due to its dominance in the foundry industry, said the sources.
China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) both plan to build additional capacity at their 8-inch fabs in China, according to company sources.
Globalfoundries is striving to be among the major contract chipmakers of Qualcomm and Apple, vying for 14nm chip orders from the two vendors, according to industry sources. Globalfoundries has successfully obtained 14nm chip orders from AMD, previously the parent company of the foundry, said the sources. AMD also has 20nm and 28nm chips made at Globalfoundries.
American semiconductor company Qualcomm recently confirmed that they will sell their Mirasol panel plant in Longtan, Taiwan, to Taiwanese local foundry TSMC. Mirasol panel manufacturing was a business under Qualcomm MEMS Technologies, a subsidiary of Qualcomm, and it was once considered a breakthrough LCD panel product. However, the related business expansion was not smooth. Early in 2012, the Mirasol panel plant reportedly halted production.
The global IC foundry market is forecast to increase 12% in 2015, outpacing the overall semiconductor sector’s 5% growth, said TSMC’s co-CEO Mark Liu at the company’s 14th annual Supply Chain Management forum held December 4. TSMC is confident that it will continue to outperform the global IC foundry market in 2015, Liu indicated. For 2014, TSMC has predicted the global IC foundry market will log a 14% increase while the overall semiconductor market is set to grow by a smaller 9%.
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to secure a combined 40-50% of Apple’s A9 processor orders for next-generation iPad and iPhone devices, according to industry sources. TSMC has declined to comment on the speculation. TSMC is believed to have grabbed the entire A9 chip orders for use in Apple’s next iPad devices, said the sources.
Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) will turn a plant recently purchased from Qualcomm into a facility devoted to the development of the advanced integrated fan-out wafer-level packaging (InFO-WLP) technology, said a Hong Kong-based institutional investor. TSMC, the world’s largest contract chip-maker, recently forked out US$85 million to purchase a plant in Longtan, Taoyuan, owned by the U.S.-based semiconductor company Qualcomm Inc.