TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry. TSMC continued that in the 10nm FinFET race, Intel will be its major competitor. Samsung disclosed during a recent technology forum in the US that the company plans to enter mass production of chips using its 10nm FinFET process by the end of 2016, about the same time as TSMC.
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to a recent Economic Daily News (EDN) report. TSMC with its 10nm FinFET node is eyeing orders for Apple’s A10 SoC chips, but Samsung Electronics will also be involved in the race for orders, the report said.
Qualcomm may not serve as one of the top-five clients for Taiwan Semiconductor Manufacturing Company (TSMC) in the second half of 2015 as the US-based chipmaker has placed more 14nm orders with Samsung Electronics, while giving more 28nm orders to United Microelectronics Corporation (UMC) and Semiconductor Manufacturing International Corporation (SMIC), according to industry sources. Qualcomm’s decision may aim to reduce its reliance on TSMC and to avoid its previous experience of not being able to gain enough 28nm foundry capacity from TSMC, the sources noted.
TSMC will reportedly manufacture fingerprint sensors for use in the next-generation iPhone series at its 12-inch wafer fabs using 65nm process technology, according to industry sources. In response, TSMC said the company does not talk about any customer engagements. For existing iPhone models, fingerprint sensors are being built using TSMC’s 0.18-micron process at the foundry’s 8-inch facilities, the sources noted.
Taiwan’s major IC foundries will see their combined revenues decrease 4.5% sequentially in the second quarter of 2015, according to Digitimes Research. Weaker-than-expected smartphone shipments as well as downward pressure on the world economy have prompted many of IC suppliers to continue adjusting their inventory levels.
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has landed SSD controller chip orders from Apple, in addition to recent orders from Marvell Technology and Phison Electronics, according to industry sources. TSMC will utilize a 28nm process to fabricate the controller chips for Apple, widening TSMC’s market share against rival foundry houses including United Microelectronics Corporation (UMC) and Globalfoundries in the segment, said the sources.
Through intensified cooperation with Taiwan Semiconductor Manufacturing Company (TSMC) and MediaTek, semiconductor IP provider ARM performed well in 2014, seeing its clients ship over 12 billion units of ARM-based SoCs and over 550 million units of Mali-based GPUs, mostly to mobile devices such as smartphones and tablets. Simon Segars, CEO of ARM, made a visit to Taiwan recently where he held talks with TSMC chairman Morris Chang about future cooperation on the next-generation 16nm and 10nm processes.
Taiwan Semiconductor Manufacturing Company’s (TSMC) backend integrated fan-out (InFO) wafer-level packaging (WLP) technology will start contributing significantly to the IC foundry’s revenues in 2016, according to industry sources. TSMC’s in-house developed InFO-WLP technology is expected to attract many orders including orders from Apple in 2016, said the sources. Qualcomm, MediaTek and Huawei are all pinpointed as potential customers of TSMC’s IC backend business.
Foundry chipmaker United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the second quarter of 2015, while sales generated from 28nm process technology will continue to grow. UMC reported consolidated revenues of NT$37.65 billion (US$1.20 billion) for the first quarter of 2015, up 1.1% sequentially, when wafer shipments increased 3.5% on quarter. Gross margin and operating margin came to 24.3% and 10.9%, respectively.
Fabless chipmaker MediaTek is expected to enter volume production of its 10-core SoC series for smartphones in the third quarter of 2015, according to industry sources. The chip solutions would be built using TSMC’s 20nm process technology. Codenamed Helios X20, the solution will be aimed at brand smartphone vendors particularly China-based ones, which are looking to upgrade their flagship device processor features to 10 cores, the sources said.
Taiwan Semiconductor Manufacturing Company Ltd. published its performance statistics for March and the first quarter of 2015. According to TSMC, the company achieved operating revenue of NTD222.03 billion, which was about CNY42.25 billion, during the first quarter of 2015, representing a year-on-year increase of 49.8% and a slight decrease of 0.2% compared with the previous quarter.
Internet of Things (IoT) will be the semiconductor industry’s next growth driver, spurring demand for chip components for use in applications particularly automotive, medical/healthcare and smart family, according to TSMC president and co-CEO CC Wei. The healthcare sector, for example, is forecast to reach US$6.8 billion in production value in 2017, said Wei. As for smart family, a family home could feature more than 500 smart devices by 2020, Wei indicated.
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips using 10nm process technology, according to TSMC chairman Morris Chang. Volume production at the new facility of Fab 15 will kick off in mid-2016, said Chang.
TSMC would prefer to set up its own 12-inch wafer fab in China, and management is evaluating the feasibility “aggressively,” according to the Taiwan-based contract chipmaker. There is no time-frame for when TSMC would build a 12-inch fab in China, said the company during an April 16 investors conference. TSMC has been advised by some of its major clients to set up 12-inch wafer facilities in China, and believes that having a local fab for advance-node manufacturing in the region could help it accurately grasp customers needs, the chipmaker indicated.
Taiwan Semiconductor Manufacturing Corp (TSMC) remained the world’s largest semiconductor foundry by taking more than half of the global market in 2014, according to tech research firm Gartner. The revenues of the worldwide semiconductor foundry market grew 16.1% in 2014 to US$46.9 billion, Gartner said in a report published on Monday. Among the top players, TSMC’s market share improved to 53.7% last year from 49.8% in 2013, and its sales increased by US$5 billion to US$25.18 billion due to the success of its advanced process 28 nanometer (nm) and 20nm technologies, Gartner said.
Taiwan Semiconductor Manufacturing (TSMC), the world’s largest semiconductor contract manufacturer, has set a goal of beginning mass production of chips on the 10-nanometer technology by the end of 2016, Mark Liu, its president and chief executive officer, said Wednesday in California. TSMC last year won huge orders for Apple’s next-generation mobile device processors, which had previously been awarded to Samsung of South Korea.
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for the fifth phase construction of its 12-inch wafer plant in central Taiwan in May, according to industry sources. TSMC will complete the installation of cleanroom facilities at the new facility in May 2016, followed by volume production at the end of the year, said the sources. The Fab 15 Phase 5 facility will be mainly for the manufacture of chips using TSMC’s 10nm process technology, the sources noted.
TAIPEI–Xintec Inc. (精材), an integrated circuit packaging services subsidiary of Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), will list on Taiwan’s over-the-counter (OTC) market on March 30. It has set an issue price of NT$42 (US$1.34) per share for the 30 million new shares to be put on the market and hopes to raise NT$1.26 billion. After the new share issuance, Xintec’s paid-in capital will increase by NT$300 million, based on each share’s par value of NT$10, to NT$2.68 billion.
M31 Technology has announced the availability of its low-voltage and low-power physical IP solutions on TSMC 55nm ultra-low power process technology. The platform provides system-on-a-chip (SoC) designers with significantly competitive low-power advantages for Internet of Things (IoT) applications, said the silicon IP provider. M31’s IP products on TSMC 55nm ultra-low power process technology include “High Density Standard Cell Library,” “General Purpose Standard Cell Library,” “One Port Register File SRAM Compiler,” “Single Port SRAM Compiler,” “Dual Port SRAM Compiler,” “Two Port SRAM Compiler,” and “Via ROM Compiler.”
Taiwan Semiconductor Manufacturing Co, the world’s largest contract chip maker, will likely not be affected by Intel’s rumored acquisition of chipmaking partner Altera, industry analysts said Sunday. Analysts familiar with Taiwan’s semiconductor sector said that because Altera has already shifted most of its orders to Intel from TSMC, the deal would not affect the bellwether Taiwanese company significantly.