TSMC to prevail in FinFET segment in 2016 and beyond, says company chairman

Taiwan Semiconductor Manufacturing Company (TSMC) will gain a majority of market share in the FinFET segment in 2016 although it will lose out to rival Samsung Electronics in 2015, according to TSMC chairman Morris Chang. TSMC will continue to lead in the FinFET segment in 2017, 2018 and beyond, Chang contended at the company’s latest investors conference.


TSMC to face tough questions on Qualcomm orders

Taiwan Semiconductor Manufacturing Company (TSMC) is to face a slew of tough questions to be asked by institutional investors at its upcoming investors conference to be held on January 15. TSMC is expected to clarify the latest market speculations indicating that Qualcomm reportedly has put a halt on trial production of its next generation chips built using a 16nm FinFET process at TSMC as reported by the Chinese-language Liberty Times on January 14.


TSMC’s revenue hits new record of NT$762.8 bil.

TAIPEI, Taiwan — Thanks to sales in mobile devices and orders placed by Apple, Taiwan Semiconductor Manufacturing Co.’s (TSMC, 台積電) sales jumped 27.8 percent to reach an all-time high of NT$762.8 billion last year. Sales of mobile devices in 2014 gave rise to TSMC’s increased 28-nanometer production levels, while Apple’s A8 processors were churned out exclusively through TSMC’s 20-nanometer production.


TSMC advises clients to order in advance

TSMC has advised its IC design clients to place wafer orders in advance so that they can secure a steady supply during the peak season and meet demand in time, according to industry sources. Many of TSMC’s IC design clients, particularly second-tier and smaller firms, have taken the advice, mainly because they want to avoid competition for wafer production capacity with the foundry’s major clients, the sources said.


TSMC forecast to unveil 3D packaging, testing technology

TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, is expected to unveil three dimensional integrated circuit packaging and testing technology in 2015, a research group said Wednesday. Citing a research report, the Market Intelligence & Consulting Institute (MIC), a division of the government-sponsored Institute for Information Industry, said that after years of development, TSMC is expected to launch the advanced 3D integrated fan out (InFO) technology next year.


TSMC has to find long-term perspective for China investment, says Chang

Taiwan Semiconductor Manufacturing Company (TSMC) has to develop a long-term perspective about investing in China, said company chairman Morris Chang, in response to the China government-led industry investment fund announced recently. TSMC has developed some thoughts about making further investments in China, but they are still immature at this stage, said Chang.


Demand for 8-inch fab equipment rises

Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity, according to industry sources. Demand for 8-inch wafer capacity has been strong in 2014, buoyed by demand for LCD driver ICs, fingerprint identification sensors, power management (PWM) IC, MEMS devices and MCUs for IoT applications, said the sources.


Qualcomm, MediaTek to diversify foundry sources, say industry watchers

Qualcomm will contract both Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its 1Xnm chips, whereas MediaTek is also likely to have more than one foundry build its high-end solutions in 2015, according to industry watchers. Judging from tight wafer production capacity and persistent high foundry costs in 2014, Qualcomm, MediaTek and other IC vendors will be eager to look for multiple foundry partners in 2015 as their shipments and performance are likely to be affected by TSMC’s supply capacity due to its dominance in the foundry industry, said the sources.


IC foundries gearing up for 8-inch fab expansions, from TW

China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) both plan to build additional capacity at their 8-inch fabs in China, according to company sources.


Globalfoundries striving to win orders from Qualcomm and Apple

Globalfoundries is striving to be among the major contract chipmakers of Qualcomm and Apple, vying for 14nm chip orders from the two vendors, according to industry sources. Globalfoundries has successfully obtained 14nm chip orders from AMD, previously the parent company of the foundry, said the sources. AMD also has 20nm and 28nm chips made at Globalfoundries.


Qualcomm Will Offload Its Mirasol Panel Plant In Taiwan

American semiconductor company Qualcomm recently confirmed that they will sell their Mirasol panel plant in Longtan, Taiwan, to Taiwanese local foundry TSMC. Mirasol panel manufacturing was a business under Qualcomm MEMS Technologies, a subsidiary of Qualcomm, and it was once considered a breakthrough LCD panel product. However, the related business expansion was not smooth. Early in 2012, the Mirasol panel plant reportedly halted production.


Global IC foundry sales to rise 12% in 2015, says TSMC co-CEO

The global IC foundry market is forecast to increase 12% in 2015, outpacing the overall semiconductor sector’s 5% growth, said TSMC’s co-CEO Mark Liu at the company’s 14th annual Supply Chain Management forum held December 4. TSMC is confident that it will continue to outperform the global IC foundry market in 2015, Liu indicated. For 2014, TSMC has predicted the global IC foundry market will log a 14% increase while the overall semiconductor market is set to grow by a smaller 9%.


TSMC to grab 40-50% of A9 chip orders

Taiwan Semiconductor Manufacturing Company (TSMC) is expected to secure a combined 40-50% of Apple’s A9 processor orders for next-generation iPad and iPhone devices, according to industry sources. TSMC has declined to comment on the speculation. TSMC is believed to have grabbed the entire A9 chip orders for use in Apple’s next iPad devices, said the sources.


TSMC to turn new plant into packaging facility, says analyst

Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) will turn a plant recently purchased from Qualcomm into a facility devoted to the development of the advanced integrated fan-out wafer-level packaging (InFO-WLP) technology, said a Hong Kong-based institutional investor. TSMC, the world’s largest contract chip-maker, recently forked out US$85 million to purchase a plant in Longtan, Taoyuan, owned by the U.S.-based semiconductor company Qualcomm Inc.


TSMC to turn new plant into packaging facility, says analyst

TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電) will turn a plant recently purchased from Qualcomm into a facility devoted to the development of the advanced integrated fan-out wafer-level packaging (InFO-WLP) technology, said a Hong Kong-based institutional investor. TSMC, the world’s largest contract chip-maker, recently forked out US$85 million to purchase a plant in Longtan, Taoyuan, owned by the U.S.-based semiconductor company Qualcomm Inc.


Taiwan Semiconductor: Big Opportunity In Tiny Wafers

Inside Taiwan Semiconductor’s fabrication — or “fab” — clean rooms pressurized with filtered air, technicians don white coveralls to control the level of contamination as they braid transistors by the billions into tiny slivers of silicon. The end product: computer chips. Taiwan Semiconductor Manufacturing (TSM) employs some 40,500 workers and operates on a foundry business model that Chairman Morris Chang pioneered in 1987.


Commentary: Who will win in race for Apple A9 chip orders?

There have been many speculations circulating about Apple’s A9 processors, which are to be used in next-generation iPhone and iPad devices in 2015. Earlier, some reports indicated that Taiwan Semiconductor Manufacturing Company (TSMC) was likely to take up the majority of the A9 orders to be released by Apple. And later Digitimes was told that TSMC and Samsung Electronics were still in the race for the application processor (AP) orders.


TSMC shares boosted by 16nm process hopes

TAIPEI — Shares of Taiwan Semiconductor Manufacturing Co. (TSMC, 台積電), the world’s largest contract chip-maker, got a boost Thursday morning on hopes that its efforts in the 16 nanometer process development will help the company secure orders from Apple Inc. for the U.S. firm’s A9 processor production next year, dealers said. Such hopes have been raised by TSMC’s announcement that its 16nm process has entered trial production stage and that commercial production for the advanced process is expected in the third quarter of next year, the dealers said.


TSMC sales top NT$80 billion in October

Monthly sales at contract chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) exceeded NT$80 billion (US$2.62 billion) for the first time in October 2014. TSMC has reported consolidated revenues of NT$80.74 billion for October 2014, up 55.9% on year and hitting a monthly record. The foundry’s cumulative 2014 sales came to NT$621.02 billion, rising 23.5% from a year earlier.


TSMC, MediaTek sales growth may top global list

TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC) and Taiwan-based integrated circuit designer MediaTek Inc. are expected to become the top two IC suppliers on a global list that forecasts IC suppliers’ sales growth, according to market information advisory firm IC Insights. Citing a research report, IC Insights said that TSMC, the world’s largest contract chip maker, is expected to enjoy 26 percent year-on-year growth in sales for 2014, the highest growth among the 20 largest IC suppliers in the world.