Qualcomm has changed the estimated amount of Snapdragon 810 sales following the loss of a “large customer” – most likely Samsung – after reported trouble meshing with the Galaxy S6. Reports started circulating around a week ago that Samsung would drop the Snapdragon 810, following Qualcomm’s decision not to make a custom version for the Galaxy S6.
DRAM chipmaker Inotera Memories has reported net profits of NT$52.91 billion (US$1.7 billion), or NT$8.32 a share, on consolidated revenues of NT$82.57 billion for 2014. Both figures marked record highs. Strong earnings in 2014 narrowed significantly Inotera’s accumulated losses to NT$390 million as of the end of 2014, and boosted its cash position to about NT$37 billion, the company disclosed.
DRAM maker Nanya Technology has reported net profits of NT$28.24 billion (US$908 million) for 2014, with EPS for the year coming to NT$11.77. Nanya posted net profits of NT$8.57 billion in the fourth quarter of 2014, hitting a quarterly record. EPS for the three-month period stood at NT$3.56. Nevertheless, Nanya’s consolidated revenues slid 5.2% sequentially to NT$12.41 billion in the fourth quarter of 2014, due to a shipment decrease of 2.8% and a 4.8% fall in DRAM ASPs.
Intel has closely cooperated with China-based IC design houses Spreadtrum Communications and Rockchip Electronics to promote its platforms in the China market in order to compete with Qualcomm and MediaTek for smartphone- and tablet-use chip solutions, according to Taiwan-based supply chain makers. Intel is set to ship 44 million tablet processors in 2015 and the volume is estimated to account for one-third of non-Apple tablet shipments.
Inotera Memories is making progress in transitioning to a newer 20nm node technology, according to the Taiwan-based DRAM memory maker. Industry observers recently indicated that four-gigabit DDR4 memory is unlikely to become mainstream for PCs until the first quarter of 2016, due to some chipmakers’ difficulty in transitioning to 20nm process technology that requires huge capital investments. Micron Technology has been identified as one of the suppliers facing the difficulty.
SEOUL: South Korea’s Samsung Electronics Co Ltd will be the main supplier of processors powering Apple Inc’s next iPhone, Maeil Business Newspaper reported on Monday, citing unidentified sources in the semiconductor industry. Samsung will be responsible for around 75 per cent of the chip production for the next iPhone, the South Korean newspaper said.
TAIPEI–MediaTek Inc., Taiwan’s leading fabless semiconductor company, announced Sunday that its MT6975 smartphone chip has received certification in record time by China Mobile. According to sources close to the industry, the Taiwanese chip maker received certification by the world’s largest mobile phone operator, as measured by subscribers, in three weeks, much faster than the average of one to two months.
Samsung Electronics and Globalfoundries have secured a combined 70% of orders for Apple’s A9 processors with their 14nm FinFET technology, according to industry sources. Samsung will be ready to produce 30,000-40,000 12-inch wafers monthly to meet demand on its 14nm process node, with the demand from both Apple and Samsung’s own handset division, said the sources. Samsung will also be building its next-generation Exynos processor on its own 14nm process.
Taiwan Semiconductor Manufacturing Company (TSMC) will gain a majority of market share in the FinFET segment in 2016 although it will lose out to rival Samsung Electronics in 2015, according to TSMC chairman Morris Chang. TSMC will continue to lead in the FinFET segment in 2017, 2018 and beyond, Chang contended at the company’s latest investors conference.
Taiwan Semiconductor Manufacturing Company (TSMC) is to face a slew of tough questions to be asked by institutional investors at its upcoming investors conference to be held on January 15. TSMC is expected to clarify the latest market speculations indicating that Qualcomm reportedly has put a halt on trial production of its next generation chips built using a 16nm FinFET process at TSMC as reported by the Chinese-language Liberty Times on January 14.
NEW DELHI: US-based semiconductor company Freescale that has R&D facility in India, said that it is enabling its partners to bring smart products to facilitate the government’s Rs1.13 lakh crore Digital India initiative. Freescale maintains digital networking and automotive R&D centres with a 1,000 strong employee base in Bangalore, Hyderabad and Noida, and offers a plethora of reference designs to enable smart products that leverages sensors, processors and microcontrollers.
The production value of Taiwan’s IC design industry reached NT$541.9 billion (US$16.98 billion) in 2014, representing an on-year growth of 14.8%, higher than the 11.7% growth recorded a year earlier, according to Digitimes Research. Shipments of smartphone solutions gained a boost in the third quarter of 2014, buoyed by the shift from 3G to 4G standards in China and smartphone replacement demand in emerging markets, including Africa, India and Russia.
A new rumor suggests Apple might have contracted Samsung to be the primary manufacturer for the S1 chip, the processor inside the upcoming Apple Watch. Apple reportedly has acquired 3,000 to 4,000 12-inch wafers every month from Samsung, in an attempt to have sufficient hardware units before the launch in spring, according to ZDNet. Each 12-inch wafer has 700 processors, meaning Apple will be grabbing 2.5 million new processors every month. By the time the Apple Watch launches, Apple should have a healthy supply of available processors.
Toshiba has approached Nanya Technology to discuss about a potential partnership, and proposed a US$1 billion offer to invest in the Taiwan-based company, according to industry sources. Alternatively, Toshiba may end up buying US$1 billion worth of production equipment for Nanya and outsouce production to the Taiwan-based DRAM maker, the sources said.
TSMC has advised its IC design clients to place wafer orders in advance so that they can secure a steady supply during the peak season and meet demand in time, according to industry sources. Many of TSMC’s IC design clients, particularly second-tier and smaller firms, have taken the advice, mainly because they want to avoid competition for wafer production capacity with the foundry’s major clients, the sources said.
TAIPEI–Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest contract chip maker, is expected to unveil three dimensional integrated circuit packaging and testing technology in 2015, a research group said Wednesday. Citing a research report, the Market Intelligence & Consulting Institute (MIC), a division of the government-sponsored Institute for Information Industry, said that after years of development, TSMC is expected to launch the advanced 3D integrated fan out (InFO) technology next year.
Chinese authorities have asked Qualcomm to collect lower patent fees from smartphone manufacturers that deploy its technology, following an antitrust investigation that began a year ago. China’s National Development and Reform Commission may also want the U.S. vendor to unbundle its licensing agreements, reported Bloomberg citing various sources. Should Qualcomm reach an agreement, it would put an end to the year-long anti-competition probe but impact a significant revenue source.
Demand for 8-inch fab tools, particularly used equipment, has risen significantly, as foundries are gearing up for their 8-inch fab expansion to grasp the rising IoT opportunity, according to industry sources. Demand for 8-inch wafer capacity has been strong in 2014, buoyed by demand for LCD driver ICs, fingerprint identification sensors, power management (PWM) IC, MEMS devices and MCUs for IoT applications, said the sources.
Qualcomm will contract both Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its 1Xnm chips, whereas MediaTek is also likely to have more than one foundry build its high-end solutions in 2015, according to industry watchers. Judging from tight wafer production capacity and persistent high foundry costs in 2014, Qualcomm, MediaTek and other IC vendors will be eager to look for multiple foundry partners in 2015 as their shipments and performance are likely to be affected by TSMC’s supply capacity due to its dominance in the foundry industry, said the sources.
China-based IC foundry Semiconductor Manufacturing International (SMIC) is looking to expand production capacity at its 8-inch wafer fab in Shenzhen, while Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) both plan to build additional capacity at their 8-inch fabs in China, according to company sources.